discount 70% in 2018-09-17 to 2018-09-19
price: USD$ 7.00
freight :USD$7.00,(Postal parcel)
Minimum Order Quantity:2
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Introduction of FR-4 products
FR4 read it verbally, but the written model was FR-4
FR-4 epoxy glass cloth laminate, according to the use of different industries, commonly known as: FR-4EpoxyCloth, epoxy plate, epoxy resin plate, brominated epoxy resin plate, FR-4 plate, glass fiber, glass fiber board, FR-4 reinforcement plate, FPC reinforcement plate, flexible circuit board reinforcing plate, FR-4 epoxy resin board FR-4, flame retardant board, laminated board, epoxy board, FR-4 plate, FR-4 plate glass, glass board, epoxy glass cloth laminate, printed circuit board drilling plate. The main characteristics and application: stable performance, good flatness, smooth surface, no pits, thickness tolerances, suitable for electronic products such as FPC requirements, reinforcement plate, PCB drilling plate, glass fiber meson, carbon film potentiometer printing glass fiber board, precision planetary gear (wafer), precision test plate electrical equipment (Electrical), baffle plate, strip, transformer insulation board, motor parts, gear grinding, electronic switch board etc..
FR4 epoxy glass cloth laminate surface color: Yellow FR-4, white FR-4, black FR-4, basket color FR-4 and so on
FR-4 is the substrate used by PCB, and it is a kind of sheet material. According to the different materials, the main categories are classified as the following four kinds:
1) FR-4: glass cloth substrate
2) FR-1, FR-2 and so on: paper substrate
3) CEM series: composite substrate
4) the FR-4 electronic cloth of the material substrate (ceramic, metal base, etc.) is dipped in epoxy phenolic resin and so on.
Characteristics: it has high mechanical and dielectric properties, good heat resistance and moisture resistance, and has good machinability.
Uses: motor, electrical equipment for structural components, including switches of various styles, `FPC reinforcing appliances, carbon film printed circuit boards, computer drilling pads, mold tooling, etc. (PCB test stand), and can be used in humid environmental conditions and transformer oil.
FR-4 performance characteristics
The vertical layer to the flexural strength of A: normal: E-1 / 150150 + 5 C = 340Mpa
Impact strength parallel to layer (beam method): = 230KJ / M
After soaking resistance (D-24 / 23): = 5 * 108.
The vertical layer to the electrical strength (90 + 2 C in transformer oil, the thickness is not less than 14.2MV / M 1mm)
Parallel to the layer. The breakdown voltage (90 + 2 C in transformer oil): = 40KV
The relative dielectric constant (50Hz = 5.5).
The relative dielectric constant (1MHz = 5.5).
The dielectric loss factor (50Hz = 0.04).
The dielectric loss factor (1MHz = 0.04).
Absorbent (D-24 / 23, thickness 1.6mm): less than 19mg
Density: 1.70-1.90g / cm3
Color: true color
Executive standard: GB / T1203.1-1998
FR-4 process performance:
(1) melting point of FR-4 process board (203 C)
(2) high resistance to chemicals
(3) low loss coefficient (Df0.0025)
(4) stable and low dielectric constant (Dk2.35)
(5) thermoplastic materials
Brief introduction of materials
Epoxy resins refer to macromolecular compounds containing two or more epoxy groups in the molecule, except for some of them, and their relative molecular mass is high. (two). The molecular structure of epoxy resin is characterized by the presence of active epoxy groups in the molecular chain, and the epoxy group can be located at the end, intermediate or ring like structure of the molecular chain. Due to the existence of active epoxy groups in the molecular structure, crosslinking reactions of various types of curing agents are formed to form insoluble, non melting polymers with three directional network structures.
1, diverse forms. The resin, curing agent and modifier system can meet the requirements of the application form. The range of the resin can be from low viscosity to high melting point solid.
2, easy curing. The epoxy resin system can be cured in the temperature range of 0~180 degrees with different curing agents.
3, strong adhesion. The existence of hydroxyl and ether bonds in the molecular chain of epoxy resin makes it highly adhesive to the material. The shrinkage of epoxy resin is low and the internal stress is small, which is also related to the adhesion strength of epoxy resin.
4, low contractility. The reaction between epoxy resin and curing agent is carried out by direct addition reaction or ring opening polymerization of oxygen in the resin molecule. No water or other volatile by-products are released. Compared with unsaturated polyester resin and phenolic resin, they show very low shrinkage (less than 2) during curing.
Epoxy board, 3240 epoxy board
Product Description: This product epoxy board: glass fiber cloth bonded by epoxy resin, heating and pressing production, model 3240, at high temperature mechanical performance, high humidity, electrical performance is stable. It is suitable for mechanical, electrical and electronic high structural components, with high mechanical and dielectric properties, good heat resistance and moisture resistance. Heat resistant class F (155 degree).
Board specification thickness: 0.1 ~ 100mm*1020*1220*/1040*1240/1000*2000
Rod routine specification: 8-200*1000/2000
Color: yellow, water, green, black
Origin: quality Germany, USA, Korea, Japan, Beijing