Connect with us

Diamond grinding wheel 125*12.7*5*16 alloy / tungsten parallel wheel size 320#400#1000#

discount 70% in 2018-09-21 to 2018-09-23
price: USD$ 49.56
freight :USD$18.00,(Express)
freight :USD$7.00,(Postal parcel)
Search Similar or mail to saler or send message to saler

Pay with PayPal, PayPal Credit or any major credit card


Single bevel grinding wheel code: PDX

Main uses:Single bevel diamond grinding wheel (PDX) is used to grind all kinds of saw teeth with an angle of less than 30 degreesGrinding all kinds of saw teeth, grinding cutters, reamers, slotting cutters, etc.

Understanding of specifications

For example, specifications: 80*8*13*5 (0.05KG/)Outer diameter * thickness * pore size * sand width.

The outer diameter of 80 mm, 8 mm diameter grinding wheel thickness is 13 mm, width 5 mm containing diamond.

   100*10*13*5     100*10*16*5       100*10*20*5(0.15KG/)

   125*10*13*8     125*10*16*8       125*10*25*8     

    125*10*32*8 (0.2KG/)

150*10*13*8150*10*32*8 (0.3KG/)

External diameter: 80mm100mm125mm150mm

Aperture: 13mm16mm20mm25mm32mm


Diamond width: 5mm8mm

Thickness: 8mm10mm


Application of diamond grinding wheel:

The resin bond diamond flat wheel is mainly used for hard alloy tools, tungsten steel, high speed steel, alloy steel, glass, stone, ceramics, magnetic materials, such as plane mold grinding, cylindrical grinding, can also be used as cutting and grinding and form grinding because of the characteristics of diamond abrasive with (high hardness, high compressive strength, wear resistance good), is the diamond grinding wheel in grinding grinding of hard brittle materials and become hardThe ideal tool for high quality alloy is not only high efficiency, high precision, good roughness, less abrasive consumption and long service life, but also can improve working conditions. It is widely used in ordinary abrasive machining to low iron content of metal and nonmetal hard and brittle materials, such as hard alloy, high alumina ceramics, optical glass, agate stone, stone and other semiconductor materials.Grinding and polishing processes for grinding of cemented carbide produced by cylindrical grinding