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3240. Green water imported epoxy resin board with glass fiber board FR4 epoxy plate plate processing gear

discount 70% in 2018-09-20 to 2018-09-22
price: USD$ 7.00
freight :USD$18.00,(Express)
freight :USD$7.00,(Postal parcel)
Minimum Order Quantity:2
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FR4 epoxy board 3240 for epoxy glass laminate
Conventional thickness: 0.3mm--50mm
Whole Zhang Changkuan: 1 meters *2 meters (can be cut zero) (actual size: 1020mm*2020mm)
Color: yellow
3240 epoxy plate meaning:
3240 is the national standard, corresponding to the EPGC201 type in IEC893-3-2.
According to JB-T2197-1996 electrical insulation material classification, naming and model compilation method:
3240 Arabia four digits
The first 3 represents lamination, winding products, vacuum pressure impregnation products
Second bit 2 represents inorganic laminate
Third bit 4 represents temperature index class F (155 degree)
Fourth bit 0 represents product variety code
3240 epoxy laminate surface is smooth, no bubbles, no pits and wrinkles, but allow other defects that do not affect the use, such as: scratches, indentation, stains and a small amount of spots. The edge should be cut neatly, and the end face shall not be divided into layers and cracks.
Implementation criteria: GB/T1303.1-1998.
Temperature tolerance grade: F
Color: natural (yellow), green, etc.
Characteristics: after curing epoxy resin system has excellent mechanical properties, high temperature strength Jie machine, good electrical properties under high humidity.
Electrical property: the cured epoxy resin system is a kind of excellent insulating material with high dielectric property, surface leakage resistance and arc resistance
Usage: suitable for mechanical, electrical, electronic, electrical and other fields. Also used in the processing of insulation parts, processing into all kinds of insulation parts and equipment insulation structure parts.
Thickness: under normal circumstances is 0.3 ~ 50mm, can also be required to produce 50~150mm thick plate.
The reaction between epoxy resin and curing agent is carried out by direct addition reaction or ring opening polymerization of oxygen in the resin molecule. No water or other volatile by-products are released. Compared with unsaturated polyester resin and phenolic resin, they show very low shrinkage (less than 2%) during curing.

To map custom processing