discount 70% in 2018-09-17 to 2018-09-19
price: USD$ 11.20
freight :USD$7.00,(Postal parcel)
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The epoxy board of the product is made of epoxy resin bonded with glass fiber cloth and heated and pressed. The model is 3240. It has high mechanical performance at moderate temperature and stable electrical performance under high humidity. It is suitable for mechanical, electrical and electronic parts with high insulation structure. It has high mechanical and dielectric properties, good heat resistance and moisture resistance. Heat resistant class F (155 degree).
Specification thickness: 0.5 ~ 100mm
Regular specification: 1000mm*2000mm
Origin: made in China
1, diverse forms. Various resins, curing agents and modifier systems can almost meet the requirements of various applications for the form, ranging from very low viscosity to high melting point solids.
2, easy curing. The epoxy resin system can be cured almost in the temperature range of 0~180 degrees with various curing agents.
3, strong adhesion. The existence of polar hydroxyl groups and ether bonds in the molecular chain of epoxy resin makes it highly adhesive to various materials. When epoxy resin is cured, the shrinkage is low and the internal stress is small, which also helps to improve the adhesion strength.
4, low contractility. The reaction between epoxy resin and curing agent is carried out by direct addition reaction or ring opening polymerization of oxygen in the resin molecule. No water or other volatile by-products are released. Their sumsUnsaturated polyester resinCompared with the phenolic resin, the curing process showed very low shrinkage (less than 2%).
5. Mechanical properties. The cured epoxy resin system has excellent mechanical properties.