Epoxy board: FR-4 glass fiber board is a flame resistant material level code, the meaning is the resin material after the combustion state of a material specification must be able to extinguish, it is not a material name, but a material level, so FR-4 grade materials are generally used on the circuit board type very much, but most are based on the so-called four function (Tera-Function) of epoxy resin and filler (Filler) and composite material made of glass fiber.
Introduction of FR-4 products
FR4 read it verbally, but the formal written model was FR-4
FR-4 epoxy glass cloth laminate, according to the use of different industries, commonly known as: FR-4EpoxyGlassCloth, insulation board, epoxy plate, epoxy resin plate, brominated epoxy resin plate, FR-4 plate, glass fiber, glass fiber board, FR-4 reinforcement plate, FPC reinforcement plate, flexible circuit board reinforcing plate, FR-4 epoxy flame retardant resin board, insulation board, FR-4 laminated board, epoxy board, FR-4 plate, FR-4 plate glass, glass board, epoxy glass cloth laminate, printed circuit board drilling plate. The main technical features and application of electrical insulating performance and stability, good flatness, smooth surface, no pits, thickness tolerance standard, suitable for application in high performance electronic insulation requirements of products, such as FPC PCB drilling plate reinforcement plate, glass fiber, carbon film potentiometer meson, printing glass fiber board, precision planetary gear (wafer grinding), precision test sheet, electrical equipment (Electrical) insulation insulation plate, strip baffle, transformer insulation board, insulation parts, gear grinding, electronic switch insulation board.
Brief introduction of materials
Epoxy resin is a polymer compound, a molecule containing two or more than two epoxy groups, in addition to individual, their relative molecular mass is not high. The molecular structure of epoxy resin in the molecular chain with lively epoxy group as its characteristic, the epoxy groups can be located in the end of the chain, or intermediate molecules into ring like structures. Because the molecular structure of epoxy containing active, so that they can be cured with various types of agent crosslinking reaction and the formation of insoluble and infusible polymers with three direction mesh structure.
1, diverse forms. All kinds of resin, curing agent, modifier system almost can adapt to all kinds of application form of the request, which can range from extremely low viscosity to high melting point of solid.
2, easy curing. The epoxy resin system can be cured almost in the temperature range of 0~180 degrees with various curing agents.
3, strong adhesion. The existence of polar hydroxyl groups and ether bonds in the molecular chain of epoxy resin makes it highly adhesive to various materials. When epoxy resin is cured, the shrinkage is low and the internal stress is small, which also helps to improve the adhesion strength.
4, low contractility. The epoxy resin and the curing agent reacts by direct addition reaction or resin molecules of the epoxy group ring opening polymerization, no water or other volatile by-products release. Compared with unsaturated polyester resin and phenolic resin, they show very low shrinkage (less than 2%) during curing.
Insulation board, epoxy board, 3240 epoxy board
Product Description: the product of epoxy board: glass fiber cloth with epoxy resin glue and heating and pressurizing production, for the 3240 model, the mechanical properties in high temperature and high humidity in stable electrical performance. It is suitable for mechanical, electrical and electronic parts with high insulation structure. It has high mechanical and dielectric properties, good heat resistance and moisture resistance. Heat resistant class F (155 degree).