Epoxy board: FR-4 glass fiber board is a flame resistant material level code, the meaning is the resin material after the combustion state of a material specification must be able to extinguish, it is not a material name, but a material level, so FR-4 grade materials are generally used on the circuit board type very much, but most are based on the so-called four function (Tera-Function) of epoxy resin and filler (Filler) and composite material made of glass fiber.
Introduction of FR-4 products
FR4 read it verbally, but the formal written model was FR-4
FR-4 epoxy glass cloth laminate, according to the use of different industries, commonly known as: FR-4EpoxyGlassCloth, insulation board, epoxy plate, epoxy resin plate, brominated epoxy resin plate, FR-4 plate, glass fiber, glass fiber board, FR-4 reinforcement plate, FPC reinforcement plate, flexible circuit board reinforcing plate, FR-4 epoxy flame retardant resin board, insulation board, FR-4 laminated board, epoxy board, FR-4 plate, FR-4 plate glass, glass board, epoxy glass cloth laminate, printed circuit board drilling plate. The main technical features and application of electrical insulating performance and stability, good flatness, smooth surface, no pits, thickness tolerance standard, suitable for application in high performance electronic insulation requirements of products, such as FPC PCB drilling plate reinforcement plate, glass fiber, carbon film potentiometer meson, printing glass fiber board, precision planetary gear (wafer grinding), precision test sheet, electrical equipment (Electrical) insulation insulation plate, strip baffle, transformer insulation board, insulation parts, gear grinding, electronic switch insulation board.
Brief introduction of materials
Epoxy resin is an organic macromolecule compound containing two or more epoxy groups in the molecule, except for some of them, the relative molecular weight of them is not high enough. (two). The molecular structure of epoxy resin is characterized by the presence of active epoxy groups in the molecular chain, and the epoxy group can be located at the end, intermediate or ring like structure of the molecular chain. Because of the active epoxy groups in the molecular structure, they can be cross-linked with various types of curing agents to form insoluble, non melting polymers with three directional network structure.
1, diverse forms. Various resins, curing agents and modifier systems can almost meet the requirements of various applications for the form, ranging from very low viscosity to high melting point solids.
2, easy curing. The epoxy resin system can be cured almost in the temperature range of 0~180 degrees with various curing agents.
3, strong adhesion. The existence of polar hydroxyl groups and ether bonds in the molecular chain of epoxy resin makes it highly adhesive to various materials. When epoxy resin is cured, the shrinkage is low and the internal stress is small, which also helps to improve the adhesion strength.
4, low contractility. The reaction between epoxy resin and curing agent is carried out by direct addition reaction or ring opening polymerization of oxygen in the resin molecule. No water or other volatile by-products are released. Compared with unsaturated polyester resin and phenolic resin, they show very low shrinkage (less than 2%) during curing.
Insulation board, epoxy board, 3240 epoxy board
Product Description: This product epoxy board: glass fiber cloth bonded by epoxy resin, heating and pressing production, model 3240, at high temperature mechanical performance, high humidity, electrical performance is stable. It is suitable for mechanical, electrical and electronic parts with high insulation structure. It has high mechanical and dielectric properties, good heat resistance and moisture resistance. Heat resistant class F (155 degree).